介电芯材

介电芯材是用于高密度互连（HDI）印制电路板的专用绝缘基材。它作为基础层，隔离导电铜层，防止电气短路，同时提供机械稳定性。该材料具有低介电常数（Dk）和低损耗因子（Df），以最小化信号损耗并在高频下保持信号完整性。它必须承受PCB制造过程中的多次层压循环，同时保持尺寸稳定性和耐热性。

介电芯材通过在多层PCB中提供导电铜层之间的电气绝缘来发挥作用。其低介电常数降低了信号传播延迟和电容耦合，而低损耗因子则最小化了以热量形式损失的能量。在PCB制造过程中，它在热和压力下层压，与铜箔结合，形成刚性复合结构。材料的热膨胀特性必须与铜匹配，以防止热循环过程中的分层。

The dielectric core material functions by providing electrical insulation between conductive copper layers in multilayer PCBs. Its low dielectric constant reduces signal propagation delay and capacitive coupling, while its low dissipation factor minimizes energy loss as heat. During PCB manufacturing, it undergoes lamination under heat and pressure to bond with copper foils, creating a rigid composite structure. The material's thermal expansion properties must match those of copper to prevent delamination during thermal cycling.