Heat spreader/baseplate is a critical thermal interface component in power semiconductor modules that efficiently transfers heat from semiconductor dies to cooling systems.
A heat spreader or baseplate is a metallic component integrated into power semiconductor modules (such as MOSFET/IGBT modules) that serves as the primary thermal conduction path. It directly contacts the semiconductor dies through thermal interface materials and provides a flat, rigid surface for mounting heatsinks or liquid cooling plates. Its primary function is to distribute heat uniformly across its surface area to prevent localized hot spots and maintain optimal operating temperatures for semiconductor devices.
诱因 → 失效模式 → 工程缓解
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A heat spreader is an integrated component that directly contacts semiconductor dies to spread heat uniformly, while a heatsink is an external component that dissipates heat to the environment through extended surfaces and airflow.
Flatness ensures maximum contact area with semiconductor dies and cooling systems, minimizing thermal interface resistance and preventing air gaps that significantly reduce heat transfer efficiency.
Oxygen-free copper offers the highest thermal conductivity (400 W/m·K), while copper-molybdenum composites provide excellent thermal conductivity with matched thermal expansion to semiconductor materials.
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