键合层

一种专用粘合界面层，用于将钨铼合金靶盘永久键合到旋转阳极X射线管的铜散热器上。该组件确保在极端热循环（表面温度高达2500°C）和离心力（高达10,000 RPM）下保持最佳热导率，同时维持结构完整性。

键合层作为热和机械界面，通过传导热传递将热量从钨铼靶盘传递到铜散热器。它通过管理热膨胀差异来维持粘附，使用顺应性材料来适应钨铼（CTE：4.5×10⁻⁶/K）和铜（CTE：17×10⁻⁶/K）之间的不匹配，同时防止在操作应力下发生分层。

The bonding layer functions as a thermal and mechanical interface that transfers heat from the tungsten-rhenium target disk to the copper heat sink through conductive heat transfer. It maintains adhesion through differential thermal expansion management, using compliant materials that accommodate the mismatch between tungsten-rhenium (CTE: 4.5×10⁻⁶/K) and copper (CTE: 17×10⁻⁶/K) while preventing delamination under operational stresses.