Thermal interface material for heat dissipation in LED arrays
A thermally conductive pad used to transfer heat from LED chips to heat sinks or substrates in LED array modules, filling microscopic air gaps to improve thermal conductivity and prevent overheating.
诱因 → 失效模式 → 工程缓解
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It reduces thermal resistance between LEDs and heat sinks, lowering junction temperatures to prevent efficiency loss and extend lifespan.
No, they are typically single-use due to material compression and potential degradation upon removal.
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