行业组件数据 · 2026

环氧基树脂

Epoxy base resin is a thermosetting polymer used as the primary binder in electrical-grade epoxy compounds for insulation and encapsulation.

技术定义与适配语境
典型 环氧基树脂 会按材料、尺寸公差、适配关系和失效风险在 电气设备制造 中评估。

Epoxy base resin is a synthetic thermosetting polymer derived from epichlorohydrin and bisphenol-A, characterized by its excellent electrical insulation properties, high mechanical strength, chemical resistance, and thermal stability. In electrical-grade epoxy resin compounds, it serves as the matrix material that binds fillers, hardeners, and additives to form rigid, durable insulating components for electrical equipment.

组件规格

定义
Epoxy base resin is a synthetic thermosetting polymer derived from epichlorohydrin and bisphenol-A, characterized by its excellent electrical insulation properties, high mechanical strength, chemical resistance, and thermal stability. In electrical-grade epoxy resin compounds, it serves as the matrix material that binds fillers, hardeners, and additives to form rigid, durable insulating components for electrical equipment.
工作原理
Epoxy base resin functions through a curing process initiated by a hardener (typically amines or anhydrides), which triggers cross-linking polymerization. This transforms the liquid resin into a solid, three-dimensional network structure, providing electrical insulation by preventing current leakage, mechanical support, and protection against environmental factors like moisture and chemicals.
材料
Bisphenol-A epoxy resin (e.g.DGEBA type)with optional modifications for enhanced properties such as flame retardancy (e.g.brominated epoxy) or flexibility (e.g.aliphatic epoxy).
Viscosity
500-2000 cP at 25°C
Volume Resistivity
1e13-1e15 ohm·cm
Dielectric Strength
15-20 kV/mm
Thermal Conductivity
0.2-0.5 W/m·K
Epoxy Equivalent Weight
180-190 g/eq
Glass Transition Temperature
100-150°C
标准
ISO 16797DIN EN 60455

行业分类与别名

环氧基树脂 的常用贸易名称、技术标识和检索关键词。

上级产品

该组件会出现在以下整机或工业产品中。

FMEA · 风险与缓解

诱因 → 失效模式 → 工程缓解

Incorrect hardener ratio or mixing->Poor curing, resulting in weak mechanical strength and electrical failures->Strict process control, automated mixing systems, and quality checks
Exposure to high humidity during storage->Reduced dielectric performance due to moisture absorption->Store in sealed containers with desiccants, control warehouse humidity

工业生态与工程逻辑

0
Incomplete curing leading to reduced insulation
1
Thermal degradation at high temperatures
2
Moisture absorption affecting dielectric properties

合规与检测

tolerance
±5% on viscosity and epoxy equivalent weight
test method
ISO 16797 for electrical properties, ASTM D257 for resistivity, IEC 60243 for dielectric strength

制造该组件的工厂

来自 CNFX 组件能力表的相关制造商资料。

制造商列表用于前期研究和供应商能力理解,不代表认证、排名或交易担保。

采购评估维度

不是客户评论,也不是实时热度。以下维度用于前期 RFQ 准备和供应商评估。

技术文档
4/5
制造能力
4/5
可检验性
5/5
供应商透明度
3/5

这些分值是采购评估维度示例,不代表真实客户评分、具体国家买家反馈或实时询盘。

相关组件

常见问题

What is the difference between epoxy base resin and cured epoxy?

Epoxy base resin is the uncured liquid or semi-solid precursor, while cured epoxy is the hardened, cross-linked final product after reaction with a hardener, exhibiting full mechanical and electrical properties.

Why is epoxy resin preferred for electrical applications?

It offers excellent dielectric strength, low moisture absorption, high adhesion, and thermal stability, making it ideal for insulating and protecting electrical components.

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CNFX Industrial Component Index · 电气设备制造

数据基础

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初步技术归类
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URN:CNFX:ME:UNIT:EPOXY_BASE_RESIN