行业组件数据 · 2026

阵列外壳/框架

Structural housing for laser displacement sensor arrays providing alignment, protection, and thermal management.

技术定义与适配语境
典型 阵列外壳/框架 会按材料、尺寸公差、适配关系和失效风险在 机械和设备制造 中评估。

A precision-engineered mechanical enclosure designed to securely mount and align multiple laser displacement sensors in a coordinated array configuration. It maintains precise geometric relationships between sensors, provides environmental protection against dust, moisture, and mechanical impacts, and manages thermal dissipation to ensure measurement accuracy. The housing typically includes mounting interfaces, cable management systems, and alignment features for industrial automation applications.

组件规格

定义
A precision-engineered mechanical enclosure designed to securely mount and align multiple laser displacement sensors in a coordinated array configuration. It maintains precise geometric relationships between sensors, provides environmental protection against dust, moisture, and mechanical impacts, and manages thermal dissipation to ensure measurement accuracy. The housing typically includes mounting interfaces, cable management systems, and alignment features for industrial automation applications.
工作原理
The housing maintains fixed spatial relationships between multiple laser displacement sensors through rigid structural design, ensuring consistent measurement planes and reference points. It provides vibration damping, thermal stability through material selection and heat sinking features, and environmental sealing to protect sensitive optical components. Alignment pins, precision machined surfaces, and adjustable mounting points ensure repeatable sensor positioning.
材料
Aluminum alloy (6061-T6 or 7075-T6) for lightweight rigidity and thermal conductivitystainless steel (304 or 316) for corrosive environmentsor engineered plastics (PEEKUltem) for electrical insulation. Surface treatments include anodizing (aluminum)passivation (stainless steel)or powder coating for environmental protection.
Weight
0.5-5 kg depending on size
Flatness
0.02 mm/m
IP Rating
IP65 minimum
Vibration Resistance
5-2000 Hz, 5G
Dimensional Tolerance
±0.05 mm
Mounting Hole Pattern
M4 or M6 threaded
Operating Temperature
-10°C to +60°C
Thermal Expansion Coefficient
23.6 × 10⁻⁶/°C (aluminum)
标准
ISO 10110-7ISO 2768-mKDIN 876DIN 4768

行业分类与别名

阵列外壳/框架 的常用贸易名称、技术标识和检索关键词。

上级产品

该组件会出现在以下整机或工业产品中。

FMEA · 风险与缓解

诱因 → 失效模式 → 工程缓解

Thermal cycling in uncontrolled environments->Dimensional changes causing sensor misalignment->Use materials with matched thermal expansion coefficients, incorporate thermal isolation features, implement temperature compensation in measurement software
Mechanical vibration from nearby equipment->Resonant frequencies affecting measurement stability->Design with damping materials, optimize natural frequency through structural analysis, use vibration-isolating mounts
Improper installation or maintenance->Gradual misalignment or seal degradation->Provide clear installation guides, design for easy inspection points, use locking fasteners, specify maintenance intervals

工业生态与工程逻辑

0
Misalignment due to thermal expansion
1
Vibration-induced measurement errors
2
Environmental seal failure
3
Galvanic corrosion in mixed-material assemblies
4
Mounting surface deformation under load

合规与检测

tolerance
Geometric tolerances per ISO 1101, dimensional tolerances per ISO 2768-mK
test method
Coordinate measuring machine (CMM) verification, laser tracker alignment checks, thermal cycling tests per IEC 60068-2-14, vibration testing per IEC 60068-2-6

制造该组件的工厂

来自 CNFX 组件能力表的相关制造商资料。

制造商列表用于前期研究和供应商能力理解,不代表认证、排名或交易担保。

采购评估维度

不是客户评论,也不是实时热度。以下维度用于前期 RFQ 准备和供应商评估。

技术文档
4/5
制造能力
4/5
可检验性
5/5
供应商透明度
3/5

这些分值是采购评估维度示例,不代表真实客户评分、具体国家买家反馈或实时询盘。

相关组件

常见问题

What are the key design considerations for sensor array housings?

Key considerations include dimensional stability under thermal cycling, vibration damping properties, material compatibility with operating environment, precision of mounting features, cable routing provisions, and maintenance accessibility while maintaining protection ratings.

How does housing design affect measurement accuracy?

Housing design directly impacts accuracy through thermal expansion management, vibration isolation, precise sensor alignment maintenance, and protection from environmental contaminants that could affect laser optics or electronics.

Can array housings be customized for different sensor configurations?

Yes, they are typically custom-designed for specific sensor models and array patterns, with modular designs available for flexible configurations in multi-sensor measurement systems.

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CNFX Industrial Component Index · 机械和设备制造

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初步技术归类
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URN:CNFX:ME:UNIT:ARRAY_HOUSING_FRAME