行业组件数据 · 2026

基板

Base plate for aluminum heat sinks providing thermal interface and structural support

技术定义与适配语境
典型 基板 会按材料、尺寸公差、适配关系和失效风险在 机械和设备制造 中评估。

A flat metallic component that serves as the primary thermal interface between a heat-generating device and the aluminum heat sink fins. It functions as both a thermal conductor and structural foundation, ensuring efficient heat transfer from the source to the extended surface area of the fins while maintaining mechanical stability and mounting integrity.

组件规格

定义
A flat metallic component that serves as the primary thermal interface between a heat-generating device and the aluminum heat sink fins. It functions as both a thermal conductor and structural foundation, ensuring efficient heat transfer from the source to the extended surface area of the fins while maintaining mechanical stability and mounting integrity.
工作原理
The base plate operates on the principle of conductive heat transfer. It absorbs thermal energy from the heat source through direct contact, then distributes this energy across its surface area to the attached fins. The flat, smooth interface minimizes thermal resistance, while its thickness and material properties determine the rate and uniformity of heat spreading before dissipation through the fins.
材料
Typically aluminum alloys (60616063) or copper (C11000) for high-performance applications. Aluminum offers good thermal conductivity (150-200 W/m·K)lightweightand cost-effectiveness. Copper provides superior conductivity (~400 W/m·K) but at higher cost and weight. Surface finishes may include anodizingnickel platingor thermal interface coatings.
Flatness
≤0.05 mm
Thickness
3-10 mm
Dimensions
Customizable to heat sink footprint
Surface Roughness
Ra ≤ 1.6 μm
Thermal Conductivity
≥150 W/m·K
Mounting Hole Pattern
Standardized (e.g., 4x M3)
标准
ISO 9001DIN EN 14024

行业分类与别名

基板 的常用贸易名称、技术标识和检索关键词。

上级产品

该组件会出现在以下整机或工业产品中。

FMEA · 风险与缓解

诱因 → 失效模式 → 工程缓解

Insufficient flatness or surface finish->Poor thermal contact leading to overheating->Implement precision machining with flatness verification and surface roughness testing
Material fatigue from thermal cycling->Cracking or warping over time->Use thermally stable alloys and design with appropriate thickness for expected thermal expansion
Improper mounting pressure->Uneven thermal interface pressure->Specify torque values for mounting hardware and include spring washers or thermal pads

工业生态与工程逻辑

0
Thermal warping under uneven heating
1
Galvanic corrosion with dissimilar metals
2
Mounting stress causing interface separation
3
Insufficient flatness reducing thermal contact

合规与检测

tolerance
±0.1 mm dimensional, ±0.05 mm flatness
test method
Thermal resistance measurement per ASTM D5470, flatness testing with coordinate measuring machine

制造该组件的工厂

来自 CNFX 组件能力表的相关制造商资料。

制造商列表用于前期研究和供应商能力理解,不代表认证、排名或交易担保。

采购评估维度

不是客户评论,也不是实时热度。以下维度用于前期 RFQ 准备和供应商评估。

技术文档
4/5
制造能力
4/5
可检验性
5/5
供应商透明度
3/5

这些分值是采购评估维度示例,不代表真实客户评分、具体国家买家反馈或实时询盘。

相关组件

常见问题

What is the primary function of a heat sink base plate?

The base plate serves as the thermal interface between the heat source and the fins, spreading heat evenly across the heat sink structure to maximize dissipation efficiency.

Why is flatness critical for base plates?

Precise flatness ensures maximum surface contact with the heat source, minimizing air gaps that create thermal resistance and reduce cooling performance.

Can base plates be customized for different applications?

Yes, base plates are often custom-designed with specific thickness, material, hole patterns, and surface treatments to match thermal requirements and mechanical constraints.

我可以直接联系工厂吗?

CNFX 是开放目录,不是交易平台或采购代理。工厂资料和表单用于帮助你准备直接沟通。

CNFX Industrial Component Index · 机械和设备制造

数据基础

CNFX 制造商资料、技术分类、公开产品信息和持续合理性检查。

初步技术归类
本页用于结构化准备研究、RFQ 和供应商评估,不替代买方自己的供应商资质审查、标准核验和技术批准。

请求制造能力信息: 基板

说明目标数量、应用场景、交期和关键技术要求,用于准备 RFQ 或供应商评估。

谢谢,信息已发送。
谢谢,信息已收到。

需要制造 基板?

对比具备该组件加工或装配能力的制造商资料。

创建制造商档案 联系我们
上一个组件
基座连杆
下一个组件
基板/夹具
URN:CNFX:ME:UNIT:BASE_PLATE