行业组件数据 · 2026

结合剂

Bond is the adhesive material that holds abrasive grains together in grinding wheels, determining wheel strength, hardness, and cutting characteristics.

技术定义与适配语境
典型 结合剂 会按材料、尺寸公差、适配关系和失效风险在 机械和设备制造 中评估。

In grinding wheel manufacturing, the bond is a critical component that cements abrasive grains (such as aluminum oxide, silicon carbide, or diamond) into a cohesive structure. It controls the wheel's mechanical properties, including its hardness grade, porosity, and ability to retain grains during cutting operations. The bond composition and distribution directly influence grinding efficiency, surface finish quality, wheel wear rate, and thermal management during material removal processes.

组件规格

定义
In grinding wheel manufacturing, the bond is a critical component that cements abrasive grains (such as aluminum oxide, silicon carbide, or diamond) into a cohesive structure. It controls the wheel's mechanical properties, including its hardness grade, porosity, and ability to retain grains during cutting operations. The bond composition and distribution directly influence grinding efficiency, surface finish quality, wheel wear rate, and thermal management during material removal processes.
工作原理
The bond functions by creating a matrix that securely holds abrasive grains in place while allowing controlled grain release as they wear or fracture during grinding. This controlled release exposes fresh, sharp cutting edges, maintaining consistent cutting performance. The bond's strength determines the wheel's hardness: stronger bonds create harder wheels that retain grains longer, while weaker bonds create softer wheels that release grains more readily for self-sharpening.
材料
Common bond materials include vitrified (ceramic/clay-based)resinoid (phenolic or epoxy resins)rubbershellacmetallic (for diamond/CBN wheels)and magnesium oxychloride. Vitrified bonds offer high porosity and thermal stabilityresin bonds provide flexibility and impact resistancemetallic bonds ensure maximum grain retention for superabrasives.
Porosity
Dense to Open structure
Bond Type
Vitrified, Resinoid, Rubber, Metallic, etc.
Hardness Grade
A to Z scale (soft to hard)
Tensile Strength
Typically 10-50 MPa depending on formulation
Curing Temperature
Varies by bond type (e.g., 1200-1300°C for vitrified)
标准
ISO 525:2013DIN 69100ISO 6103:2014

行业分类与别名

结合剂 的常用贸易名称、技术标识和检索关键词。

上级产品

该组件会出现在以下整机或工业产品中。

FMEA · 风险与缓解

诱因 → 失效模式 → 工程缓解

Excessive grinding pressure or speed->Bond fracture leading to wheel breakdown->Follow manufacturer's speed and feed recommendations, use proper dressing procedures
Chemical attack from coolants or workpiece materials->Bond degradation and premature grain loss->Select chemically resistant bond types, use compatible coolants

工业生态与工程逻辑

0
Bond failure causing wheel disintegration
1
Incorrect bond selection leading to poor surface finish
2
Thermal damage from inadequate bond heat resistance
3
Chemical incompatibility with coolants or workpiece materials

合规与检测

tolerance
Wheel dimensions per ISO 525: ±0.2-0.8 mm depending on diameter, balance requirements per ISO 6103
test method
Ring test for soundness, tensile strength testing, hardness testing via indentation or sonic methods, porosity measurement

制造该组件的工厂

来自 CNFX 组件能力表的相关制造商资料。

制造商列表用于前期研究和供应商能力理解,不代表认证、排名或交易担保。

采购评估维度

不是客户评论,也不是实时热度。以下维度用于前期 RFQ 准备和供应商评估。

技术文档
4/5
制造能力
4/5
可检验性
5/5
供应商透明度
3/5

这些分值是采购评估维度示例,不代表真实客户评分、具体国家买家反馈或实时询盘。

相关组件

常见问题

What is the difference between vitrified and resin bonds?

Vitrified bonds are ceramic-based, fired at high temperatures to create rigid, porous wheels ideal for precision grinding. Resin bonds are organic polymer-based, offering flexibility and impact resistance for rough grinding and cutting-off operations.

How does bond hardness affect grinding performance?

Harder bonds retain abrasive grains longer, suitable for grinding hard materials with light pressures. Softer bonds release grains more readily, providing self-sharpening action ideal for grinding soft, ductile materials or applications requiring cool cutting.

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CNFX Industrial Component Index · 机械和设备制造

数据基础

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初步技术归类
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URN:CNFX:ME:UNIT:BOND