行业组件数据 · 2026

芯片托盘凹槽

A precision recess in machine bases designed to securely hold and align chip trays during semiconductor manufacturing processes.

技术定义与适配语境
典型 芯片托盘凹槽 会按材料、尺寸公差、适配关系和失效风险在 机械和设备制造 中评估。

The Chip Tray Recess is a machined cavity or depression integrated into the structural base of semiconductor manufacturing equipment, engineered to provide exact positioning, vibration damping, and thermal stability for chip trays that carry wafers through various processing stages. This component ensures precise alignment with robotic handlers and maintains consistent tray orientation during high-speed operations.

组件规格

定义
The Chip Tray Recess is a machined cavity or depression integrated into the structural base of semiconductor manufacturing equipment, engineered to provide exact positioning, vibration damping, and thermal stability for chip trays that carry wafers through various processing stages. This component ensures precise alignment with robotic handlers and maintains consistent tray orientation during high-speed operations.
工作原理
Works by providing a geometrically constrained interface that locates the chip tray through mechanical registration features (such as pins, edges, or grooves), often incorporating damping materials or thermal management elements to absorb vibrations and control temperature fluctuations during semiconductor fabrication processes.
材料
Typically manufactured from high-grade aluminum alloys (e.g.6061-T6 or 7075) for lightweight rigidityor stainless steel (e.g.304 or 316) for enhanced corrosion resistance. May include embedded elastomeric damping inserts or ceramic thermal pads.
Depth
5-20 mm
Flatness
≤ 0.1 mm/m²
Tolerance
±0.05 mm
Load Capacity
10-50 kg
Surface Finish
Ra ≤ 0.8 μm
Thermal Stability
≤ 0.01 mm/°C
标准
ISO 9001ISO 14644SEMI S2DIN 876

行业分类与别名

芯片托盘凹槽 的常用贸易名称、技术标识和检索关键词。

上级产品

该组件会出现在以下整机或工业产品中。

FMEA · 风险与缓解

诱因 → 失效模式 → 工程缓解

Wear on registration surfaces->Gradual loss of positioning accuracy->Regular calibration and use of wear-resistant coatings
Thermal cycling stress->Dimensional instability and cracking->Material selection with matched thermal expansion coefficients
Contaminant buildup->Interference with tray seating->Design with drainage features and scheduled cleaning protocols

工业生态与工程逻辑

0
Misalignment causing wafer damage
1
Thermal expansion affecting precision
2
Material fatigue from repeated loading
3
Contamination accumulation in recess

合规与检测

tolerance
Maintains positioning accuracy within ±0.05 mm under operational conditions
test method
Coordinate measuring machine (CMM) verification, laser alignment testing, thermal cycling validation

制造该组件的工厂

来自 CNFX 组件能力表的相关制造商资料。

制造商列表用于前期研究和供应商能力理解,不代表认证、排名或交易担保。

采购评估维度

不是客户评论,也不是实时热度。以下维度用于前期 RFQ 准备和供应商评估。

技术文档
4/5
制造能力
4/5
可检验性
5/5
供应商透明度
3/5

这些分值是采购评估维度示例,不代表真实客户评分、具体国家买家反馈或实时询盘。

相关组件

常见问题

What is the primary function of a Chip Tray Recess?

To provide precise mechanical registration and stability for chip trays in semiconductor equipment, ensuring accurate positioning during automated handling and processing operations.

Why are tolerance specifications critical for this component?

Tight tolerances (typically ±0.05 mm) prevent misalignment that could cause wafer damage, processing errors, or robotic handling failures in high-precision semiconductor manufacturing.

How does the Chip Tray Recess contribute to vibration control?

Through integrated damping materials and optimized geometry that absorb mechanical vibrations from adjacent equipment, preventing resonance that could affect wafer positioning accuracy.

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CNFX Industrial Component Index · 机械和设备制造

数据基础

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初步技术归类
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URN:CNFX:ME:UNIT:CHIP_TRAY_RECESS